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'''15:30 Block "Fach- und Werkmodule"''' | '''15:30 Block "Fach- und Werkmodule"''' | ||
* Werkmodul 'Multimediale Web-Platform & E-Learning' | * Werkmodul 'Multimediale Web-Platform & E-Learning' | ||
** [[/Multimediale Web-Platform und E-Learning/]] | ** [[/Multimediale Web-Platform und E-Learning/]] | ||
* | * Werk- u. Fachmodul 'Music Interaction Programming' | ||
** [[/Music Interaction Programming/]] | ** [[/Music Interaction Programming/]] | ||
'''16:15 Block " | * Fachmodul 'Responsive Webdesign' | ||
** [[/Responsive Webdesign/]] | |||
* Werk- u. Fachmodul 'All Hail The Pixels' | |||
** [[/All Hail The Pixels/]] | |||
'''16:15 Block "Exchange Programs"''' | |||
* Bauhaus Universität Weimar: Project 'Society of Networked Things' | * Bauhaus Universität Weimar: Project 'Society of Networked Things' | ||
** [[/Elahe Rostami and Andrés Arteaga - sharelog/]] | ** [[/Elahe Rostami and Andrés Arteaga - sharelog/]] | ||
** [[/Shalika Hanum - Ask BELLA/]] | |||
** [[/Nicklas Slagbrand, Xiangzhen Lu - Project Bench/]] | ** [[/Nicklas Slagbrand, Xiangzhen Lu - Project Bench/]] | ||
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* University at Buffalo, SUNY: 'Mobile Apps with HTML5' | * University at Buffalo, SUNY: 'Mobile Apps with HTML5' | ||
** [[/Mobile Apps|Mobile Apps]] | ** [[/Mobile Apps|Mobile Apps]] | ||
* Tongji University | |||
** [[/Flexible Interfaces for Data Visualization & Responsive Webdesign/]] | |||
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* Bachelor Projektmodul 'Interface Design 1 - Methoden und Experimente im Interface Design I' | * Bachelor Projektmodul 'Interface Design 1 - Methoden und Experimente im Interface Design I' | ||
**[[/Heinrich Roolf - FabLab-App/]] | ** [[/Heinrich Roolf - FabLab-App/]] | ||
** [[/Philipp Wartenberg - reuse.it/]] | ** [[/Philipp Wartenberg - reuse.it/]] | ||
** [[/Xianzhi Zhang - Litlog/]] | |||
* Master Freies Projektmodul I' | |||
** [[/Tobias Westphal - HistoGlobe/]] | |||
* Master Projektmodul 'Interface Design 3 - Tangible Interfaces with Printed Electronics and 3D-MID I' | * Master Projektmodul 'Interface Design 3 - Tangible Interfaces with Printed Electronics and 3D-MID I' | ||