Online application: Deutschlandstipendium

PLEASE NOTE:

This scholarship format is only suitable for students who have already been admitted to study at the Bauhaus-Universität Weimar.

As soon as you have prepared your application documents, you can upload them here:

Please fill this form and upload your application documents as one PDF file (incl. all documents, the file name should include your last name, max. 15MB).
After your click on "Continue" an overview appears where you can check again your data and change it, if necessary. It may occur that you need to upload your file again.
Not until the click on "Send values now" your application incl. your application documents will be send successfully.

Application form Deutschlandstipendium

onlinebewerbungdeutschlandstip

Personal Details

Last Name*

First Name*

Date of Birth*

Nationality*

2nd nationality if applicable

Gender

email address*

Last school or university degree*

Studies (current degree programme and subject-related semester)*

end of standard period of study*

Faculty*

Prizes/Awards

Previous Employment/Internships

Community Involvement

Further applications*

Application documents (1 PDF file incl. all documents)*

Note:

Attachments max. file size: 15 MB

Privacy*

I assure the accuracy of the information provided here, including all materials attached and I agree that the Bauhaus-Universität Weimar stores the data for internal purposes. The data will not be passed on to third parties.

I understand that providing incorrect, untrue or incomplete information can exclude me from funding.

Data storage as per §13 DSGVO:
On the basis of your consent, which you give when sending your details, the data you enter will be collected and stored by the Bauhaus Research School for the purpose of applying for a scholarship at the Bauhaus-Universität Weimar. Further information on data collection can be found in the University's privacy policy (see below on this website). If you have any questions, please contact the scholarship coordinator directly.

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